manufacturing issues related to oxide semiconductors thin-film
transistors, along with new opportunities for increased device
performance, greater TFT integration at the systems level, and innovative
applications and products. Submissions included:
• Novel Oxide Materials
• Device Structures and Processing Techniques
• Solution Processing of Oxides and Ink-Jet Printing of TFTs
• Bias, Thermal, Optical, and Environmental Stability and
Reliability of TFTs
• TFT Device Physics,Compact Modeling, and Parameter
• Design and Compensation Techniques for
Instability and Non-Uniformity in Pixelated Arrays
• Oxide TFT Sensors and Applications
• Integration on Flexible Substrates and Novel Applications
• Towards Systems-on-Panel and Very-Large-Scale
Oxide versus LTPS TFTs for Active-Matrix Displays
Jin Jang, Kyung Hee University, Seoul, South Korea
|ABSTRACT: The advantages and disadvantages of LTPS and oxide TFTs for active-matrix displays will be discussed, and future prospects for both technologies will be described. Also, a bulk accumulation mode for oxide TFTs to improve its driving ability, uniformity, and bias stability for its application to high- resolution AMOLED is proposed.
||Application of Rotation Magnet Sputtering Technology to a-IGZO Film Depositions
Tetsuya Goto, Tohoku University, Sendai, Japan
|ABSTRACT: New magnetron sputtering equipment, called rotation magnet sputtering (RMS), where multiple moving plasma loops are exited on the planar target surface, resulting in high target utilization, have been developed. The moving plasma loops also worked efficiently to homogenize the spatial distribution of a-IGZO film qualities by the time-averaged homogenization effect.
||Value of LTPS: Present and Future
Hiroyuki Ohshima, Japan Display, Inc., Tokyo, Japan
|ABSTRACT: LTPS is a well-established backplane TFT technology for displays. Its superior characteristics are indispensable for high-end smartphones and tablet PCs. LTPS will become more important in the future to satisfy the severe requirements for those devices. LTPS may open up opportunities for new applications other than displays.
||Current Status and Future Promise of Excimer-Laser Annealing for LTPS on Large Glass Substrates
Rainer Paetzel, Coherent LaserSystems GmbH & Co. KG, Gottingen, Germany
|ABSTRACT: Low-temperature polysilicon (LTPS) is the enabling backplane technology for AMOLED displays and small high-resolution AMLCDs. Recently, excimer-laser annealing (ELA) equipment has made significant progress in scaling for cost-effective large-scale production. The key elements of ELA equipment and the recent and future milestones for LTPS on large substrates will be discussed.
||LTPS vs Oxide Backplanes for AMOLED Displays: System Design Considerations and Compensation Techniques
Reza Chaji, IGNIS Innovation, Waterloo, Ontario, Canada
|ABSTRACT: The two major backplane technologies for AMOLED displays are LTPS and oxides. Despite their similarities, the differences are significant, requiring intricate design considerations and compensation techniques to achieve good display uniformity and lifetime while eliminating second-order effects associated with IR drop, ground bouncing, and parasitic capacitance.
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