Special Topics


Program



LTPS vs. Oxide TFT

Advancements and manufacturing issues related to oxide semiconductors thin-film transistors, along with new opportunities for increased device performance, greater TFT integration at the systems level, and innovative applications and products. Submissions included:


• Novel Oxide Materials
• Device Structures and Processing Techniques
• Solution Processing of Oxides and Ink-Jet Printing of TFTs
• Bias, Thermal, Optical, and Environmental Stability and Reliability of TFTs
• TFT Device Physics,Compact Modeling, and Parameter Extraction Circuits
• Design and Compensation Techniques for Instability and Non-Uniformity in Pixelated Arrays
• Oxide TFT Sensors and Applications
• Integration on Flexible Substrates and Novel Applications
• Towards Systems-on-Panel and Very-Large-Scale Integration


HOT PAPERS:
Session Paper Author(s)
3.1 Oxide versus LTPS TFTs for Active-Matrix Displays Jin Jang, Kyung Hee University, Seoul, South Korea
ABSTRACT: The advantages and disadvantages of LTPS and oxide TFTs for active-matrix displays will be discussed, and future prospects for both technologies will be described. Also, a bulk accumulation mode for oxide TFTs to improve its driving ability, uniformity, and bias stability for its application to high- resolution AMOLED is proposed.
3.2 Application of Rotation Magnet Sputtering Technology to a-IGZO Film Depositions Tetsuya Goto, Tohoku University, Sendai, Japan
ABSTRACT: New magnetron sputtering equipment, called rotation magnet sputtering (RMS), where multiple moving plasma loops are exited on the planar target surface, resulting in high target utilization, have been developed. The moving plasma loops also worked efficiently to homogenize the spatial distribution of a-IGZO film qualities by the time-averaged homogenization effect.
8.1 Value of LTPS: Present and Future Hiroyuki Ohshima, Japan Display, Inc., Tokyo, Japan
ABSTRACT: LTPS is a well-established backplane TFT technology for displays. Its superior characteristics are indispensable for high-end smartphones and tablet PCs. LTPS will become more important in the future to satisfy the severe requirements for those devices. LTPS may open up opportunities for new applications other than displays.
8.2 Current Status and Future Promise of Excimer-Laser Annealing for LTPS on Large Glass Substrates Rainer Paetzel, Coherent LaserSystems GmbH & Co. KG, Gottingen, Germany
ABSTRACT: Low-temperature polysilicon (LTPS) is the enabling backplane technology for AMOLED displays and small high-resolution AMLCDs. Recently, excimer-laser annealing (ELA) equipment has made significant progress in scaling for cost-effective large-scale production. The key elements of ELA equipment and the recent and future milestones for LTPS on large substrates will be discussed.
13.2 LTPS vs Oxide Backplanes for AMOLED Displays: System Design Considerations and Compensation Techniques Reza Chaji, IGNIS Innovation, Waterloo, Ontario, Canada
ABSTRACT: The two major backplane technologies for AMOLED displays are LTPS and oxides. Despite their similarities, the differences are significant, requiring intricate design considerations and compensation techniques to achieve good display uniformity and lifetime while eliminating second-order effects associated with IR drop, ground bouncing, and parasitic capacitance.


For a complete list of papers on this topic, please click here.

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