Special Topics

Special topics for the SID International Symposium at Display Week 2027

Special Topics at Display Week 2027

The Technical Symposium will place emphasis on four special topics of interest to address rapid growth in the areas listed below. Papers related to these special topics may also align with core symposium categories.

Authors may submit papers under any general symposium topic or special topic, and should indicate both the relevant symposium topic and special-topic designation (if applicable) when submitting an abstract.

Heterogeneous Integration on Glass and Other Substrates for Emerging Applications

Heterogeneous integration for high-performance electronic packaging is rapidly becoming a mainstream activity, with glass emerging as a promising candidate for interposer substrates in multichip integrated circuit packaging. This special topic invites submissions from both display and non-display industrial and academic communities engaged in innovative work to advance the science and engineering of heterogeneous integration. This field, by its nature, covers a broad range of areas. Submissions are invited on the following topical areas, though contributions are not limited to these topics:

Through-Glass and Other Substrates via Patterning Techniques with Emphasis on Substrate Thickness, Pitch, and Diameter Considerations, as well as Taper Angles
Voidless Metal Filling Processes with Considerations for Low Electrical Resistivity, High-Aspect Ratio Filled Vias, and Solder-Dam Integration
Wafer- and Panel-Scale Format Manufacturing Processes for Hetero-Integration Substrate Variants
Dielectric Deposition Processes for Multi-Layer Metal Interconnects Addressing Warpage Issues and Bonded Stacks
Chiplets and IC packaging for multiple die integration into single package, TGVs enabling high-density, low-loss interconnects, near-packaged optics (NPOs) for placement of optical modules close to processors and co-packaged optics (CPOs) integrating optics within the chip package for data center applications
Component (Including Die Attach) and Micro-Systems Hetero-Integration, Including Integrated Circuits, with Considerations of Performance and Integration Density Targeting Emerging Applications that Demand Ultra-High Interconnect Density, Low-Latency Data Movement, and Energy-Efficient Computing for Artificial Intelligence, Edge Computing, and Neuromorphic Systems
Packaging Technologies for a Broad Range of Applications in MEMS, 6G mmWave GHz Radios, Photonics and LEDs, High-Performance Computing, and Other Areas Addressing Lifetime, Reliability, and Critical Thermal Issues
Novel Materials, Processes, and Equipment for Hetero-Integration Applications on Rigid and Flexible Substrates
Multi-Physics Modeling and Simulation of Heterogeneously Integrated Systems Predicting Operation of Multi-Material Systems with Large Range of Length Scales of Interest, Taking into Consideration Reliability/Lifetime and Mechanical/ Electrical Behavior across a Broad Range of Temperatures
Co-Design Approaches: Electrical–Mechanical– Thermal–Optical Co-Optimization Emphasizing System-Level Design Methodologies that Integrate Substrate Materials, Component Layout, and Functional Requirements Early in the Development Cycle
Security-Aspects in Heterogeneous Integration, Discussing Hardware-Level Security in Advanced Packaging, Especially as Interposers Are Used in Secure Computing Applications
Sustainable Manufacturing and Recyclability in Heterogeneous Integration Processes, Addressing Environmental Considerations, Material Lifecycle, and Potential Reuse of Interposer Substrates (Especially Glass)
Standardization, Testing, and Characterization Methodologies for Glass-Based Heterogeneous Integration, Including Metrology Challenges, Test Structures, and Evaluation Protocols for Electrical, Thermal, and Mechanical Reliability
Integration with Embedded Power Delivery and Thermal Management Features, Including Microfluidics, Embedded Capacitors, and Thermal Vias for Higher Power Density and Reduced Thermal Resistance in Dense 3D Architectures

Next-Generation Materials: Perovskites and Beyond

As the display industry evolves beyond traditional OLEDs and quantum dots, novel semiconducting materials are rapidly emerging to define the next wave of display innovation. Among these, metal halide perovskites have demonstrated exceptional progress in both photoluminescent and electroluminescent performance, achieving external quantum efficiencies (EQEs) rivaling commercial OLEDs and QLEDs, along with rapidly improving operational stability and color purity, as well as other applications such as transistors, image sensors, and other applications.

This Special Topic seeks to spotlight cutting-edge research on perovskite-based emitters and other emerging light-emitting systems that lie outside the conventional OLED, microLED, and QD roadmap as well as electronic applications for display backplanes, sensors, and relevant electronics. It focuses on the scientific and technological foundations needed to realize commercially viable next-generation displays, including materials synthesis, device engineering, integration strategies, and advanced photophysics.

The session will provide a platform for materials scientists, device physicists, and industry developers to share their latest insights and foster cross-disciplinary collaboration toward future-proof display technologies. Topics include, but are not limited to:

High-Efficiency Electroluminescent Perovskites: Bulk, Quasi-2D, Colloidal, and in-situ Synthesized
Scalable Fabrication and Patterning of Perovskite Light Emitters for Large-Area Displays
Perovskite emitters for color conversion applications
Lead-Free and Environmentally Benign Perovskite Derivatives
Novel Emitter Systems: Carbon Nanodots, Metal Nanoclusters, Thermally Activated Delayed Fluorescence (TADF) Hybrids, and Other Unconventional Materials
Optically or Electrically Pumped Nano-Lasers and Coherent Light Sources for Display Applications
Interface and Charge Transport Layer Engineering for Emerging Emitters
Chiral and Spin-Polarized Light Emission in Advanced Emissive Materials
Fundamental Photophysical Mechanisms in New Emitters: Radiative Recombination Dynamics, Exciton Transport, and Optical Coupling
Integration of Emerging Emitters in Neuromorphic Display Platforms
Perovskite Electronics Beyond Displays
Perovskite Transistors and Memories
Mass Production of Perovskite Nanocrystals
Thermally Evaporated Perovskites LEDs

Super-Sensing XR Headsets for Enhanced Awareness

Super-Sensing XR headsets could significantly enhance situational awareness by providing users with optimized vision and other sensing beyond human capabilities. These headsets or glasses can potentially offer telescopic imaging, magnification, expanded light spectrum visibility, and low-light vision as well as correcting many common ophthalmic and auditory issues. These technologies could also enable accurate distance measurement, enhance GPS navigation efficiency, support advanced communication functions, and facilitate comprehensive analysis of both immediate and extended user environments to provide relevant information.

Current smartphones already possess some of these capabilities, but next-generation XR headsets or glasses could replace most imaging and communication devices with hands-free access. With advanced multifaced imaging, AI assistance, and continuous data recording, these headsets will offer unprecedented human sensing, analysis, and communications enhancements. Furthermore, these capabilities can be continuously available to record and analyze to assist the user.

Creating such head-worn devices or smart-eyeglasses involves integrating multiple types of cameras and sensors, selecting the best images, and managing data storage and retrieval.

Solicited research papers include:

Novel Miniature Cameras and Sensors
Integration of Multiple Cameras and Sensors, on the Headset and Externally, often with Multiple Functions
Hands-free user-controlled semi-automation of sensor and data functions
Enhanced Mnemonics and Life-Quality Assistance Functions
AI Assistance Regarding what Images and Data to Prioritize, Store, Retrieve, Analyze, and Report
External Device (IoT) Control Capabilities for Remote Devices
Automated Eyesight Correction to Improve User Image Perception and Analysis
Automated and Enhanced Auditory Perception and Analysis Sensing
Other Sensors to Enhance Situational Awareness such as Enhanced Olfactory, Antigen, and Pathogen Sensing
Ultra-High Speed and Bandwidth Communications and Data Processing for Head-Worn Devices or Glasses

Sustainable Displays and Green Technologies

The global reach of the display industry and its value chain has brought transformative changes to the human experience, altering how we work, communicate, learn, and spend leisure time. At the same time, the growing scale and huge output of the display industry bring proportional demands on environmental and social resources, while risking excluding portions of the world population.

This Special Topic aims to bring together contributions related to sustainable display development, achieving goals for net zero emissions, a circular economy, and an inclusive society, including areas such as:

Display Product Designs for Repairability, Durability, Upgradeability, and Circularity
Reduction, Recycling, or Elimination of the Use of Rare or Critical Materials such as Gallium, Cerium, Indium, or Iridium
Sustainable Materials for Display Components and Products
Waste-Water Treatment Technologies, Water Usage Efficiency Enhancements, and Water Resource Management
Green Display Manufacturing Processes and Materials, Reducing Environmental and Social Impact from Operations and Chemicals
Green Packaging and Transportation of Displays
Technologies for Display Energy Efficiency Improvements, Measurements, and Assessments
Technologies for Display-Users’ Health and Safety
Technologies for Display Lifetime Extensions
Repurpose, Upcycling, and Recycling of Waste Displays
Life Cycle Assessment of Displays, Including the Methodologies, Hot Spots Analysis, Improvement, etc.
Regulatory and Compliance Perspectives for Display-Related Sustainability Areas; e.g in the Context of the UN Sustainable Development Goals (SDGs), the EU Ecodesign for Sustainable Products Regulation (ESPR), and/or Other Regulatory Bodies
Third-Party Sustainability Certifications (Environmental/Social) and Green Standards for Displays and Display-Containing Products
Sustainable Procurement of Display Products
Incenting the Display Industry to Act with Environmental Responsibility
Display’s New Application for Other Green Areas
A Socially Conscious Display Designed to Serve Diverse Populations with Inclusive Features and Affordable Pricing

Core Symposium Topics

The Society for Information Display (SID) encourages the submission of original papers on all aspects of the research, engineering, application, evaluation, and utilization of displays. Paper submissions are welcome for any of the following core symposium topics. Download the Core Symposium Topics list for more details.

(1) ACTIVE-MATRIX DEVICES: Submissions are solicited covering novel aspects of active-matrix devices and TFT technologies, including semiconductor materials, device architectures and processing, interfaces and reliability, modeling and circuit design, and their integration into display backplanes, sensors, memory, and other related electronic systems.

(2) ADAPTIVE DISPLAY TECHNOLOGIES:WEARABLE, FLEXIBLE, AND NON-VOLATILE: Adaptive display technologies use novel form factors, display characteristics, or system integration to meet new application needs. This subcommittee invites contributions on form-factor adaptation — including wearable, flexible, stretchable, foldable, rollable, and free-form displays — as well as environmental adaptation, such as non-volatile, reflective displays and electronic paper. We welcome papers on material innovations, mechanical design, structural integration, and manufacturing techniques that enable these adaptive capabilities.

(3) APPLIED VISION/HUMAN FACTORS: NNew display technology — more pixels, greater contrast, higher luminance, and richer color volume — is enabling new visual experiences. This topic covers the benefits and tradeoffs of these advances, including comfortable 3D imagery (autostereoscopic, AR, and VR), effective use of wider color volume, and ways to leverage the limits of human vision for more efficient displays. Papers on novel user interaction and HCI methods with display systems are also welcome.

(4) ARTIFICIAL INTELLIGENCE FOR DISPLAYS AND IMAGING: Artificial intelligence is reshaping how display and imaging systems are designed, manufactured, evaluated, and experienced. This committee covers machine learning, deep learning, generative AI, foundation models, and autonomous systems across the display and imaging lifecycle — from materials and device design to image processing, metrology, manufacturing, reliability, and user interaction.

(5) AUTOMOTIVE/VEHICULAR DISPLAYS AND HMI TECHNOLOGIES: This topic covers all aspects of automotive and vehicular displays and related HMI issues, including market trends, display and lighting technologies, head-up displays, smart displays, and advanced touchscreen and gesture technologies for vehicles, as well as the driver and passenger experience.

(6) DISPLAY ELECTRONICS: All aspects of circuits (integrated or otherwise) for displays, electronic components for displays, and imaging devices, and image and video-processing algorithms will be considered.

(7) DISPLAY MANUFACTURING: Papers on materials, processes, and equipment advancements related to the manufacture of display panels, components, and module assemblies will be considered.

(8) DISPLAY MEASUREMENT: Submissions are encouraged that address the electro-optic characterization and measurements of displays and display components.

(9) DISPLAY SYSTEMS: The Display Systems Subcommittee is soliciting original papers on the novel integration of displays into specialized devices as well as system-level aspects of electronic displays.

(10) EMERGING TECHNOLOGIES AND APPLICATIONS: Display and imaging technologies are rapidly evolving beyond their traditional roles. This track highlights technologies with strong potential to shape future display and imaging systems, inventive applications of display technologies across diverse domains, and integrations of display and non-display technologies that unlock new forms of interaction, sensing, or visualization. We seek truly novel, rule-breaking concept papers, as well as papers with pre-commercial feasibility data or prototypes.

(11) EMISSIVE, MICROLED, AND QUANTUM DOT DISPLAYS: Advances in materials, processes, designs, and functions of emissive displays — including quantum dots, perovskites, microLEDs, field nano-emitters, and nano-phosphors — are sought, along with emissive display-compatible sensors and smart-display technologies such as integrated sensors, micro-ICs, LiFi, and electro-optical elements.

(12) INTERACTIVE DISPLAYS AND SENSORS: As displays increasingly encompass the entirety of a device, this topic covers integrating new modalities — human input, imaging, biometrics, acoustics, and connectivity — within or under a display without compromising visual performance. It also solicits novel standalone sensors and transducers that are based on display industry technologies, have a clear path to display integration, or significantly impact display architecture

(13) LIQUID-CRYSTAL TECHNOLOGY: Papers are sought on advances in the development of liquid crystal, including electro-optical effects, materials, applications, and devices.

(14) ORGANIC LIGHT-EMITTING DIODES: Topics of interest include OLED materials and device architectures, as well as OLED display design, prototyping, manufacturing, and performance. Papers on OLED signage and OLED lighting solutions are also welcome.

(15) XR FOR DISPLAYS AND IMAGING: We invite submissions on developing extended reality (XR) — augmented reality (AR), virtual reality (VR), and mixed reality (MR) — into a ubiquitous mainstream technology. XR is a key enabler for the digitally reconstructed virtual world, with applications spanning education, entertainment, engineering, healthcare, human sensory enhancement, and smart manufacturing. Papers will be organized into tracks covering the full range of emerging XR technologies and applications.