Heterogeneous integration for high-performance electronic packaging is rapidly becoming a mainstream activity, with glass emerging as a promising candidate for interposer substrates in multichip integrated circuit packaging. This special topic invites submissions from both display and non-display industrial and academic communities engaged in innovative work to advance the science and engineering of heterogeneous integration. This field, by its nature, covers a broad range of areas.

As the display industry evolves beyond traditional OLEDs and quantum dots, novel semiconducting materials such as metal halide perovskites are defining the next wave of innovation, with efficiencies rivaling commercial OLEDs and QLEDs. This Special Topic seeks cutting-edge research on perovskite-based and other emerging light-emitting systems, as well as backplane and sensor electronics. It brings together materials scientists, device physicists, and industry developers to advance next-generation displays.

Super-sensing XR headsets could significantly enhance situational awareness by providing vision and sensing beyond human capabilities, including telescopic imaging, low-light vision, expanded spectral visibility, and correction of common vision and hearing issues. Combined with AI assistance and hands-free communication, they could replace most imaging and communication devices. This Special Topic addresses integrating multiple cameras and sensors, selecting the best images, and managing data storage and retrieval.

The global reach of the display industry and its value chain has brought transformative changes to the human experience, altering how we work, communicate, learn, spend leisure time, and interact with light. At the same time, the growing scale and huge output of the display industry bring proportional demands on environmental, social, and health resources, while risking the exclusion of portions of the world’s population.