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Dear Author,

Once again, it is a pleasure to inform you that your paper has been accepted for a poster presentation at the SID 2013 Conference at the Vancouver Convention Centre in Vancouver, British Columbia Canada.

The Poster Session will consist of about 200 papers in topical groupings.  A 4 ft. high x 8 ft. wide poster board with ample tacks and 3 ft. x 18 inches of table space for handouts and demos will be available to each presenter.  Authors are expected to remain with their posters throughout the session for questions and discussion.

This acceptance is subject to three conditions: (1) all company or government releases must have been obtained; (2) the paper shall be in agreement with SID copyright rules; (3) the SID DIGEST material and forms must be submitted by March 8, 2013.

Illustrated text of all symposium papers will appear in the SID ‘12 DIGEST OF TECHNICAL PAPERS (hard-copy and CD-ROM versions).  This document enjoys a worldwide distribution that includes many scholarly libraries. Unless otherwise instructed, your paper may be included in other SID Publications or referred to in publicity releases for SID ‘13.  The DIGEST format allows up to four pages per paper for text and illustrations combined.

THE DEADLINE FOR SUBMISSION OF AN ELECTRONIC MANUSCRIPT IS MARCH 8, 2013.  Please view all three of the following sections when preparing and submitting your paper.

I. Templates

To help you prepare your submission, SID has developed "Author Guidelines" and "Digest Specifications."  These guidelines can be accessed at the following URL:

Author Guidelines       Digest Specifications

For questions about templates, please contact Lisa Tolles-Efinger, phone: 908/213-8988, email:

II. Paper Submission and Forms

After your paper is complete, please use the instructions at the following URL to submit the electronic version of your paper:

Digest Paper Submission (pdf version here)

For questions about submissions, please contact William Klein, 1-212-460-9700, email:

III. Author Information

For further details regarding your oral presentation, please use the following URL:

Author Information

Sincerely yours,

Shintson Wu


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